Product details
D-Sub Micro-D Connectors 37way Socket Solder Cup
Part number (MPN)
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We coordinate supplier-qualified RF connector and cable assembly sourcing from drawings, samples, or BOM. Typical production lead time is 3–6 weeks after drawing/spec review; feasibility, MOQ, and fit are confirmed by RFQ.
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- • Share the reference MPN and source brand if it matters.
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- • Attach the drawing or the key fit requirements.
Specifications
| Interface | Micro-D D-Sub Connectors |
|---|---|
| Gender | Female |
| Orientation | Straight |
| Termination | Solder Cup |
| Mounting | Panel |
| Termination | Copper Alloy |
| Termination | Gold |
| Current Rating | 3 A |
| Shell Material | Aluminium Alloy |
| Filtered | Unfiltered |
| Number of Positions | 37 Position |
| Product Category | D-Sub Micro-D Connectors |
Show 7 more specs
| Number of Rows | 2 Row |
|---|---|
| Shell Plating | Electroless Nickel |
| Tradename | Dura-Con |
| Voltage Rating | 600 VAC |
| RoHS | Y |
| Subcategory | D-Sub Connectors |
| Insulation Material | Glass Filled Thermoplastic |
Description
Current reference data for DCDH-37SSBN: Straight · Straight · Solder Cup. The catalog currently lists the configuration as: Straight · Solder Cup. Mounting is listed as Straight. If panel, bulkhead, or flange constraints matter, send the dimensions with the RFQ. Material is listed as Aluminium Alloy. That is useful for review, but it does not replace full project stack-up confirmation. Use this page to shortlist before RFQ, not as the final sign-off.
Use this page to shortlist before RFQ. MOQ 200+ custom production and supply path are confirmed after drawing/spec/BOM review; no spot stock is assumed.
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Disclaimer
Manufacturer names, trademarks, symbols, and part numbers are used for identification and cross-reference only. Cstone Technology is a China-based export sourcing partner for compatible alternatives and is not affiliated with the original brands. Trademarks remain the property of their respective owners. Final suitability is confirmed by drawing/spec review during RFQ.