Product details

D-Sub Backshells D SUB IP67 25POLE BLACK PLASTIC HOOD

China-sourced compatible alternative — fit confirmed by drawing/spec review.

Part number (MPN)

9670250436

WhatsApp — Quick Reply
Lead time: 3–6 wks | MOQ: 200+ pcs
Before RFQ Clear inputs speed up review.
  • Share the reference MPN and source brand if it matters.
  • Add the BOM and volume split for production projects.
  • Attach the drawing or the key fit requirements.

Specifications

Specifications for 9670250436
InterfaceD-Sub Backshells
InterfaceTwo Piece Backshell
OrientationStraight
HardwareSlot Head Jackscrews
Product CategoryD-Sub Backshells
SubcategoryD-Sub Connectors
Shell MaterialThermoplastic
IP ratingIP67
Unit Weight1.139349 oz
PackagingBulk
Cable type1 Entry
Shell Size3 (B)
Show 4 more specs
Filtered-
Part # Aliases025 0436 09 09-67-025-0436 09670250436 67 9670250436
Number of Positions25 Position
RoHSY

Description

Current reference data for 9670250436: Straight. The catalog currently lists the configuration as: Straight. If mounting is missing here, confirm it from the drawing or mating requirement. Material is listed as Thermoplastic. That is useful for review, but it does not replace full project stack-up confirmation. The catalog also lists a sealing or protection value of IP67. Check that against the real environment requirement in RFQ. Use this page to shortlist before RFQ, not as the final sign-off.

Use this page to shortlist before RFQ. MOQ 200+ custom production is confirmed after drawing/spec/BOM review.

Similar Connectors

Related models:

MPN Search Supports exact, prefix, and partial matching.

Supports exact, prefix, and partial matching.

Disclaimer

Manufacturer names, trademarks, symbols, and part numbers are used for identification and cross-reference only. Cstone Technology is a China-based export sourcing partner for compatible alternatives and is not affiliated with the original brands. Trademarks remain the property of their respective owners. Final suitability is confirmed by drawing/spec review during RFQ.