Product details

Single packaging

China-sourced compatible alternative — fit confirmed by drawing/spec review.

Part number (MPN)

85177169

Impedance

50Ω

Frequency

0 GHz ... 6 GHz

Interface

N / jack (female)

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Lead time: 3–6 wks | MOQ: 200+ pcs
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85177169 product photo

85177169 product photo

Specifications

Specifications for 85177169
InterfaceN / jack (female)
Impedance50Ω
Frequency (max)0 GHz ... 6 GHz
TerminationCopper Beryllium Alloy / Gold Plating
TerminationBrass / Tri-metal Plating
BodyBrass / Tri-metal Plating
InsulatorPTFE (Polytetrafluoroethylene)
Coupling mechanismBrass / Tri-metal Plating
GasketVMQ (Silicone rubber)
Attenuation nominal6 dB
VSWR1.25
Return loss19.1 dB
Show 10 more specs
Frequency (max)0.5 dB
Average power5 W at 25 °C ambient temperature. Linearly derated to 0.5 W at 100 °C ambient temperature.
Peak power500 W, 5 µs pulse width, 0.5 % duty cycle
Weight0.07 kg
Operation temperature-55 °C ... 125 °C
DirectiveRoHS 2011/65/EU and (EU) 2015/863
RatingContains one or more SVHC >0,1%
Exemptions6c
RegulationREACH 1907/2006 Article 33 SVHC
DetailsCAS: 7439-92-1 Lead

Description

Current reference data for 85177169: N / jack (female) · 50Ω · 0 GHz ... 6 GHz. Impedance is listed as 50Ω. If that parameter is critical, confirm it again in RFQ. Frequency is listed as 0 GHz ... 6 GHz. The real operating limit still depends on the assembly, mating pair, and application context. If mounting is missing here, confirm it from the drawing or mating requirement. Use this page to shortlist before RFQ, not as the final sign-off.

Use this page to shortlist before RFQ. MOQ 200+ custom production is confirmed after drawing/spec/BOM review.

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Disclaimer

Manufacturer names, trademarks, symbols, and part numbers are used for identification and cross-reference only. Cstone Technology is a China-based export sourcing partner for compatible alternatives and is not affiliated with the original brands. Trademarks remain the property of their respective owners. Final suitability is confirmed by drawing/spec review during RFQ.