Product details
Single packaging
Part number (MPN)
Impedance
50 Ω
Frequency
18 GHz
Interface
SMA
Before RFQ Clear inputs speed up review. ⌄
- • Share the reference MPN and source brand if it matters.
- • Add the BOM and volume split for production projects.
- • Attach the drawing or the key fit requirements.
Image
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Specifications
| Interface | SMA |
|---|---|
| Interface | 18 GHz |
| Interface | 2-hole flange |
| Impedance | 50 Ω |
| Gender | jack |
| Standard | IEC 60169-15_MIL-STD-348A/310_CECC 22110 |
| Termination | Copper Beryllium / Brass / SUCOPRO Plating |
| Outer conductor | Brass / SUCOPRO Plating |
| Body | Brass / SUCOPRO Plating |
| Insulator | PTFE (Polytetrafluoroethylene) |
| Weight | 0.0058 kg |
| Operation temperature | -65 °C ... 125 °C |
Show 5 more specs
| Directive | RoHS 2011/65/EU and (EU) 2015/863 |
|---|---|
| Rating | Contains one or more SVHC >0,1% |
| Exemptions | 6c |
| Regulation | REACH 1907/2006 Article 33 SVHC |
| Details | CAS: 7439-92-1 Lead |
Description
Current reference data for 84136630: SMA · 50 Ω · 18 GHz. Impedance is listed as 50 Ω. If that parameter is critical, confirm it again in RFQ. Frequency is listed as 18 GHz. The real operating limit still depends on the assembly, mating pair, and application context. For higher-frequency projects, include the drawing, cable path, and critical requirements in the first RFQ. Mounting is listed as 2-hole flange. If panel, bulkhead, or flange constraints matter, send the dimensions with the RFQ. Use this page to shortlist before RFQ, not as the final sign-off.
Use this page to shortlist before RFQ. MOQ 200+ custom production is confirmed after drawing/spec/BOM review.
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Disclaimer
Manufacturer names, trademarks, symbols, and part numbers are used for identification and cross-reference only. Cstone Technology is a China-based export sourcing partner for compatible alternatives and is not affiliated with the original brands. Trademarks remain the property of their respective owners. Final suitability is confirmed by drawing/spec review during RFQ.