Product details
Tape and Reel packaging
Part number (MPN)
Impedance
50 Ω
Frequency
6 GHz
Interface
MMCX
Before RFQ Clear inputs speed up review. ⌄
- • Share the reference MPN and source brand if it matters.
- • Add the BOM and volume split for production projects.
- • Attach the drawing or the key fit requirements.
Image
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Specifications
| Interface | MMCX |
|---|---|
| Interface | 6 GHz |
| Interface | surface mount |
| Impedance | 50 Ω |
| Gender | jack |
| Standard | HUBER+SUHNER-MMCX |
| Termination | Copper Beryllium Alloy / Gold Plating (Nickel underplated) |
| Outer conductor | Brass / Gold Plating (without Nickel underplating) |
| Body | Brass / Gold Plating (without Nickel underplating) |
| Insulator | PFA / PTFE |
| Weight | 0.0006 kg |
| Mating cycles | 500 |
Show 5 more specs
| Height above PCB HA | 5.3 mm |
|---|---|
| Operation temperature | -55 °C ... 155 °C |
| Directive | RoHS 2011/65/EU and (EU) 2015/863 |
| Rating | Compliant with exemption |
| Exemptions | 6c |
Description
Current reference data for 23023564: MMCX · 50 Ω · 6 GHz. Impedance is listed as 50 Ω. If that parameter is critical, confirm it again in RFQ. Frequency is listed as 6 GHz. The real operating limit still depends on the assembly, mating pair, and application context. For higher-frequency projects, include the drawing, cable path, and critical requirements in the first RFQ. Mounting is listed as surface mount. If panel, bulkhead, or flange constraints matter, send the dimensions with the RFQ. Use this page to shortlist before RFQ, not as the final sign-off.
Use this page to shortlist before RFQ. MOQ 200+ custom production is confirmed after drawing/spec/BOM review.
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Disclaimer
Manufacturer names, trademarks, symbols, and part numbers are used for identification and cross-reference only. Cstone Technology is a China-based export sourcing partner for compatible alternatives and is not affiliated with the original brands. Trademarks remain the property of their respective owners. Final suitability is confirmed by drawing/spec review during RFQ.