Product details
Single packaging
Part number (MPN)
Impedance
50 Ω
Frequency
4 GHz
Interface
BNC
Before RFQ Clear inputs speed up review. ⌄
- • Share the reference MPN and source brand if it matters.
- • Add the BOM and volume split for production projects.
- • Attach the drawing or the key fit requirements.
Image
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Specifications
| Interface | BNC |
|---|---|
| Interface | TNC |
| Interface | 4 GHz |
| Impedance | 50 Ω |
| Gender | jack (female) |
| Gender | jack (female) |
| Standard side 1 | IEC 61169-8_MIL-STD-348A/301_CECC 22120 |
| Termination | Copper Beryllium Alloy / Gold Plating (without Nickel underplating) |
| Outer conductor | Brass / SUCOPLATE (R) Plating |
| Body | Brass / SUCOPLATE (R) Plating |
| Insulator | PFA / PTFE |
| Standard side 2 | IEC 60169-17_MIL-STD-348A/313_CECC 22200 |
Show 9 more specs
| Frequency (max) | 20 dB |
|---|---|
| Weight | 0.0142 kg |
| Mating cycles | 500 |
| Operation temperature | -65 °C ... 165 °C |
| Directive | RoHS 2011/65/EU and (EU) 2015/863 |
| Rating | Contains one or more SVHC >0,1% |
| Exemptions | 6c |
| Regulation | REACH 1907/2006 Article 33 SVHC |
| Details | CAS: 7439-92-1 Lead |
Description
Current reference data for 22540639: BNC · 50 Ω · 4 GHz. Impedance is listed as 50 Ω. If that parameter is critical, confirm it again in RFQ. Frequency is listed as 4 GHz. The real operating limit still depends on the assembly, mating pair, and application context. If mounting is missing here, confirm it from the drawing or mating requirement. Use this page to shortlist before RFQ, not as the final sign-off.
Use this page to shortlist before RFQ. MOQ 200+ custom production is confirmed after drawing/spec/BOM review.
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Disclaimer
Manufacturer names, trademarks, symbols, and part numbers are used for identification and cross-reference only. Cstone Technology is a China-based export sourcing partner for compatible alternatives and is not affiliated with the original brands. Trademarks remain the property of their respective owners. Final suitability is confirmed by drawing/spec review during RFQ.